T.K. Cheung appointed Spire Payments’ new President

Spire Payments announced today T.K. Cheung has been selected as Spire’s new President to spearhead aggressive expansion into North America, Latin America and Southeast Asia.

Spire Payments, a rapidly expanding Fintech payment solution provider is currently ranked in the top 3 POS and mPOS companies in Europe, comprises of 10 offices, over 100 official partners across the globe, and operates in 48 markets.

“I’m truly honoured to have been appointed as Spire Payments’ next President. Having been part of the payments ecosystem for over three decades it is truly a privilege to head-up a business renowned for delivering exceptional levels of service and being recognised as a market-leading innovator in the FinTech ecosystem,” said T.K. “We strive to deliver end-to-end solutions which not only allow our customers to optimise their operating environments, but also leverage the very latest technological advancements and innovation. The Spire Payments senior-leadership team consists of many seasoned professionals and experts who have operated in this discipline for decades. The end result is a business driven by unparalleled payments knowledge and the ability to design and deliver world-class solutions.”

T.K. has over 30 years’ experience in the telecom and payments’ industries, encompassing a variety of executive leadership roles in business development, product management, and engineering at companies like Hypercom and American Express.

“I can think of no better person to head-up our rapidly expanding business,” commented Alain Fernando-Santana, Spire Payments Chief Administration Officer and Executive Vice President. “T.K.’s exceptional experience within the payments space across multiple disciplines makes him the perfect candidate to take Spire Payments to the next level. Our strategy is simple, yet ambitious: strong geographical expansion built on a well-planned solution roadmap that will ensure all our current and future customers will benefit from the latest payment innovations.”